Recent Trend of Reliability Technology. Evaluation of Strength Reliability of Plastic Packaging.
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چکیده
منابع مشابه
High Reliability Plastic Packaging for Microelectronics
This Laboratory Directed Research & Development (LDRD) project conducted in fiscal years 1996 and 1997 under case 3526.030 was devoted to the development of test structures and associated measurement methodology for assessing the reliability of plastic encapsulated microelectronic devices. The end goal was the conceptual specification of one or more Assembly Test Chips (ATCs) which could be use...
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ژورنال
عنوان ژورنال: The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
سال: 1997
ISSN: 1884-1201,1341-0571
DOI: 10.5104/jiep1995.12.391